$200

CI-006 Copper Nanoparticles

Aerosol Conductive InksConductive Inks
Deposition: Aerosol
Vehicle: Glycol ether
Resistivity: 3.4E-6 to 7.7E-6 ohm-cm
Substrates: PET, polyimide
Features: Requires laser curing under reducing atmosphere or formic acid vapor
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Suitable for Polyimide (PI) and PET substrates, CI-006 is a glycol-ether-based copper nanoparticle superior conductive ink with aerosol pneumatic atomization, and is both photonically sinterable and solderable on PI – and on PET with a formic acid atmosphere. CI-006 requires laser curing under reducing atmosphere or formic acid vapor.

Pigment/Loading: Copper nanoparticles @ 60wt%
Vehicle: Glycol ether
Resistivity: 3.4E-6 ohm-cm (laser with H2); 7.7E-6 ohm-cm (30min @ 190C formic acid)
Substrates: PET, polyimide
Features: Requires laser curing under reducing atmosphere or formic acid vapor
Atomizer: Pneumatic

 

Technical Data Sheet

Safety Data Sheet