Suitable for Polyimide (PI) and PET substrates, CI-006 is a glycol-ether-based copper nanoparticle superior conductive ink with aerosol pneumatic atomization, and is both photonically sinterable and solderable on PI – and on PET with a formic acid atmosphere. CI-006 requires laser curing under reducing atmosphere or formic acid vapor.
|Pigment/Loading:||Copper nanoparticles @ 60wt%|
|Resistivity:||3.4E-6 ohm-cm (laser with H2); 7.7E-6 ohm-cm (30min @ 190C formic acid)|
|Features:||Requires laser curing under reducing atmosphere or formic acid vapor|