Conductive Inks
Showing all 11 results
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Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.7E-6 to 7.3E-4 ohm-cm Substrates: Plastics, Glass, (Paper with PulseForge processing) Features: Contains a fluoropolymer binder for excellent adhesion -
Deposition: Screen Print Vehicle: Aqueous-based Resistivity: 5.1E-6 to 2.8E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Low viscosity, high conductivity -
Deposition: Screen Print Vehicle: Butyl carbitol Resistivity: 1.0E-5 to 2.3E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Excellent adhesion and water resistance -
Vehicle: Dowanol PM Resistivity: 3.8E-5 to 1.0E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Excellent adhesion and water resistance -
Deposition: Screen Print Vehicle: Butyl carbitol Resistivity: 1.0E-5 to 2.3E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Excellent adhesion and water resistance -
Deposition: Screen Print Vehicle: Butyl carbitol Resistivity: 5.1E-6 to 2.8E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Low viscosity, high conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Plastics, (Paper with PulseForge processing) Features: High conductivity -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 9.9E-6 to 5.3E-4 ohm-cm Substrates: Plastics, Glass, (Paper with PulseForge processing) Features: Contains a polyurethane binder for excellent adhesion -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Treated polyester, polyimide, polycarbonate, polyurethane, paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating.