Conductive Inks
Showing all 8 results
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Deposition: Inkjet Vehicle: Aqueous-based Resistivity: 1.1 to 1.3 ohm-cm Substrates: Coated and uncoated plastics Features: Resistive ink contains fluoropolymer for excellent adhesion -
Deposition: Flexo Vehicle: Aqueous-based Resistivity: 4.5 E-6 to 5E-6 ohm-cm Substrates: PET, Treated Polyolefins, Polyimide, PC, Polyurethane, Coated Papers Features: Designed for treated polyolefin (e.g. PE and PP) surfaces. Exhibits high electrical conductivity, good abrasion and scratch resistance, low surface roughness, and excellent adhesion. May also be printed on other types of plastic and label paper. Suitable applications include antenna, RFID, and sensor. -
Deposition: Screen Print Vehicle: Aqueous-based Resistivity: 4.2E-6 to 1.0E-5 ohm-cm Substrates: Treated polyester, polyimide, glass, polycarbonate, coated papers, and cardstock Features: High conductivity, low surface roughness -
Deposition: Screen Print Vehicle: Aqueous-based Resistivity: 4.9E-6 to 1.4E-5 ohm-cm Substrates: Treated polyester, polyimide, glass, polycarbonate, coated papers, and cardstock Features: Excellent adhesion, low surface roughness -
Deposition: Inkjet Vehicle: Glycol ether Resistivity: 9.0E-6 ohm-cm Substrates: Coated and uncoated glass Features: Process with laser or formic acid vapor -
Deposition: Inkjet Vehicle: Aqueous-based Resistivity: 0.5 to 0.8 ohm-cm Substrates: Coated and uncoated plastics and glass Features: Resistive ink contains fluoropolymer for excellent adhesion -
Deposition: Inkjet Vehicle: Aqueous Resistivity: 7.8E-6 to 3.1E-5 ohm-cm Substrates: Coated papers, coated or uncoated plastics, and glass Features: Reflective silver ink for digital optical effects -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Treated polyester, polyimide, polycarbonate, polyurethane, paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating.