Solder paste is heated indirectly through a light-absorbing layer and components. | |
High contrast ratio absorption between layers allows for selective heating. | |
Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate. | |
High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers. |
Multiple types of components requiring different levels of heat can be soldered simultaneously. | |||
Processing is much faster than reflow soldering and is roll-to-roll compatible. | |||
Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method. |
Headquartered in Austin, TX, NovaCentrix offers industry leading photonic curing tools, conductive inks, material and expertise enabling development and production of next generation printed electronic devices.