NovaCentrix has developed a reliable non-laser technology to rapidly and economically lift-off polymeric films carrying thin film electronic structures from rigid glass substrates. PulseForge® Lift-Off™ is suitable for OLED, TFT-based displays and photovoltaic applications.
Ultrafast heating of the interface leads to decomposition of the polymeric surface and leads to release of the free-standing polymeric film | Glass carrier substrates are upgraded with additional light absorbers to enhance interface heating and prevent light exposure within the device stack | ||
Expandable to meet Generation 5.5 substrate size needs | PulseForge® Lift-OffTM process is not feasible on crystalline silicon | ||
High absorption and high thermal tolerance substrate is required for fidelity of processing |
Equipment costs are a fraction of laser-based lift-off processing tools | Removal of the device stack without illuminating the active layer | ||
Enhanced tolerance for imperfections within the polyimide coating | Processing rate of up to 5m/min |
Headquartered in Austin, TX, NovaCentrix offers industry leading photonic curing tools, conductive inks, material and expertise enabling development and production of next generation printed electronic devices.