NovaCentrix has developed a reliable non-laser technology to rapidly and economically lift-off polymeric films carrying thin film electronic structures from rigid glass substrates. PulseForge® Lift-Off™ is suitable for OLED, TFT-based displays and photovoltaic applications.
|Ultrafast heating of the interface leads to decomposition of the polymeric surface and leads to release of the free-standing polymeric film||Glass carrier substrates are upgraded with additional light absorbers to enhance interface heating and prevent light exposure within the device stack|
|Expandable to meet Generation 5.5 substrate size needs||PulseForge® Lift-OffTM process is not feasible on crystalline silicon|
|High absorption and high thermal tolerance substrate is required for fidelity of processing|
|Equipment costs are a fraction of laser-based lift-off processing tools||Removal of the device stack without illuminating the active layer|
|Enhanced tolerance for imperfections within the polyimide coating||Processing rate of up to 5m/min|