• May 10, 16
  • NovaCentrix
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SAN JOSE, Calif. ─ FlexTech, a SEMI Strategic Association Partner, today announced the formal completion of three flexible hybrid electronics (FHE) R&D projects under its U.S. Army Research Laboratory (ARL) technology investment agreement. The completed projects are with ENrG for a flexible ceramic substrate; nScrypt and NovaCentrix for a next-generation three-dimensional (3D) printing tool for creating complex and functional objects; and PARC, a Xerox company, for a flexible sensor platform. Projects ranged from 12-18 months and were managed by a member of the FlexTech Technical Council, which is a team of experts in flexible, hybrid and printed electronics technologies.

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