Conductive Inks
Showing 25–33 of 33 results
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Deposition: Aerosol Vehicle: Aqueous Resistivity: 3.0E-4 to 1.0E-5 ohm-cm Substrates: Plastics, glass and metal Features: Contains a polyurethane for excellent adhesion and water resistance -
Vehicle: Dowanol PM Resistivity: 3.8E-5 to 1.0E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Excellent adhesion and water resistance -
Deposition: Screen Print Vehicle: Butyl carbitol Resistivity: 1.0E-5 to 2.3E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Excellent adhesion and water resistance -
Deposition: Screen Print Vehicle: Butyl carbitol Resistivity: 5.1E-6 to 2.8E-5 ohm-cm Substrates: Paper, plastics, glass, metal Features: Low viscosity, high conductivity -
Deposition: Screen Print Vehicle: Butyl Carbitol Resistivity: 67E-6 – 3.5E-6 ohm-cm Substrates: Paper, plastics, glass, metal Features: Good conductivity, fine line printing, excellent adhesion and water resistance -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 9E-6 to 1.1E-5 ohm-cm Substrates: PET, polyimide, PC, polyurethane Features: Well-suited for applications where a high electrical conductivity is required. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 1.2E-5 to 1.4E-5 ohm-cm Substrates: PET, polyimide, PC, polyurethane, ABS Features: Easily cured at temperatures as low as 70˚C. Cured films exhibit excellent scratch and abrasion resistance, salt spray resistance, and excellent adhesion. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 6.4E-6 to 1.1E-5 ohm-cm Substrates: Glass, transparent conducting oxides (TCO), treated polyester, polyimide Features: Specifically designed for glass and transparent conducting oxide (TCO) surfaces. When cured, exhibits high electrical conductivity, good adhesion, and low surface roughness. May be used as a seed layer for electroplating metals. -
Deposition: Spray Vehicle: Aqueous-based Resistivity: 5.7E-6 to 1.7E-5 ohm-cm Substrates: Treated polyester, polyimide, polycarbonate, polyurethane, paper Features: Produces cured films with high electrical conductivity, good scratch and abrasion resistance, and good adhesion. May be used in EMI / RF shielding, filter and membrane design for wastewater treatment, and as a seed layer for metal electroplating.